ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
Latest agreement aims to advance thermocompression and hybrid bonding methods for chiplet packages
Jul 23, 2024
SINGAPORE and ARMONK, NEW YORK, July 23, 2024
-- ASMPT and IBM (NYSE:
IBM
) today announced a renewed agreement to extend their...
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